Processor | Each Node: Supports Single Socket Intel® Xeon® P Skylake up to 205W TDP socket LGA3647 |
System Chipset | Intel C622 chipset |
System Memory | Each Node: Supports up to 6x DIMMs DDR4 RDIMM/RDIMM 3DS/LRDIMM/LRDIMM 3DS 2666 |
Storage | Each node: 36 ports 12G SAS Expander with 3 SFF8643 Connectors |
Driver Bays | 12 hot-swap 3.5" 12G/6G SAS/SATA drive bay; Each node: 2x internal 2.5" 7mm for OS drive bays |
Cooling | Each node: 5x 40 mm fans |
Expansion | Each Node: 1x PCI-E 3.0 x8; 2x PCI-E3.0 x16; 1x Broadcom LSI3008 (Optional) |
Operating Temperature | 0°C ~ 35°C |
Storage Temperature | -20°C ~ 70°C |
Relative Humidity | 5% ~ 95% relative humidity, non-condensing |
HTS Code | 8473 30 5100 |
ECCN | 4A994 |
Compliance | CE, FCC Class A, RoHS 6/6 compliant |
Dimensions (W x H x D) | System: 26.5"x19"x3.5" (LxWxH) Packaging: 37"x25.2"x13.8"(LxWxH |
Weights | Net Weight 50lbs w/o Hard Drives; Gross Weight: 68 |