FlacheSAN2N12C-D5 2U 12 NVMe Add-In-Card PCIE x8 Dual Xeon SP
FlacheSAN2N12C-D5 2U 12 NVMe Add-In-Card PCIE x8 Dual Xeon SP
Key Features
- All NVMe Flash Array supports Dual Intel® Xeon® SP Scalable Processors (Skylake)
- Support 12 x front accessible hot-swap NVMe PCIe3 x8 Add-in-Cards
- Up to 60GB/s (480 Gigabits/s) throughput and 12 Millions IOPS through RDMA
- Support 4x full height PCIe3 x16 and 2x Low Profile PCIe3 x16 slots
- Symmetrically balanced design, each CPU managing half NVMe and NIC
         
          Specification
            
          
       
        
        | System | |
|---|---|
| Processor | Supports Dual Intel® Xeon® SP (Skylake) up to 205W TDP socket LGA3647 | 
| System Chipset | Intel® C621 chipset | 
| System Memory | Supports 16x DDR4 ECC RDIMM/LRDIMM 2133/2400/2666MT/s max. 2TB capacity | 
| Storage | 12x Low Profile Front Hot-Swappable PCIe3 x8 NVMe Add-in-Card | 
| Driver Bays | 12x PCIe x8 slots, 2x 2.5" internal drive bays and 2x 2.5" 7mm rear hot-swap drive bays | 
| Cooling | 4x 80mm high speed fans | 
| Environment | |
| Operating Temperature | 0°C ~ 35°C | 
| Storage Temperature | -20°C ~ 70°C | 
| Relative Humidity | 5% ~ 95% relative humidity, non-condensing | 
| HTS Code | 8473 30 5100 | 
| ECCN | 4A994 | 
| Compliance | CE, FCC Class A, RoHS 6/6 compliant | 
| Physical | |
| Dimensions (W x H x D) | System: 30"x19"x3.5" (LxWxH) Packaging: 37"x 24"x10"(LxWxH) | 
| Weights | Gross: 29KG/64LBS; Net: 25KG/55LBS | 
         
          Resource
            
          
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| Data Sheet | 
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| Product Brief | 
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